Calculator · Thermal Engineering
Plane-Wall Conduction
Steady plane-wall conduction: thermal resistance, signed heat rate and heat flux for constant conductivity.
Inputs
Boundary order is geometric, not a forced hot-to-cold ordering. Positive Q̇ flows 1 → 2; negative Q̇ flows 2 → 1. Temperatures are in kelvin.
Results
Heat-transfer rate Q̇
4 kW
Boundary 1 → boundary 2
| Equivalent thermal resistance | 0.025 K/W |
|---|---|
| Heat flux q″ | 400 W/m² |
Assumptions
- · Steady 1D series path; constant conductivity in each layer.
- · Perfect solid interfaces; no contact resistance or heat generation.
- · Prescribed uniform convection coefficients; no correlation is inferred.
- · Positive heat rate flows from boundary 1 toward boundary 2; a negative rate reverses the flow.
Explore in the Lab
Open in Heat Transfer Lab
The same ordered geometry and boundary temperatures travel to the Lab.
Technical reference
R = L/(kA)
Q̇ = (T₁ − T₂)/R
q″ = Q̇/A
- R
- thermal resistance[K/W]
- Q̇
- signed heat-transfer rate[W]
- k
- thermal conductivity[W/(m·K)]
- h
- prescribed convection coefficient[W/(m²·K)]
Steady heat transfer with constant material properties. No radiation, transient storage or inferred convection correlations.